Nokia Files A Patent About Haptic Material

Nokia hasn’t yet seen a significant success with its Windows Phone smartphones yet. But apparently, the company hopes for a better future since it has been working on filing patents related to different technologies that may be used with a smartphone. Whereas Nokia earlier bagged a slide-to-unlock patent, it has now applied for a patent regarding haptic notification system.


The patent, which has been filed with the US Patent office, is numbered 20120062371. Although it is bit too technical in nature, from what we have gathered, it is about a topical haptic notification system. A brief excerpt from the description Nokia provided for the said patent may give you an idea of what it is about, “An apparatus comprising: a material attachable to skin, the material capable of detecting a magnetic field and transferring a perceivable stimulus to the skin, wherein the perceivable stimulus relates to the magnetic field.”

This can be a significant feature for the telecom industry in the coming days and Nokia doesn’t forget to stress the general use of the technology for communication indications, and then a specific application in telecom messages.

The material that Nokia is trying to patent uses ferromagnetic powder and responds to magnetic fields by vibrating. Running the horses of our imagination wild, we can say that once it becomes a real-world thing, you may feel a small part of your skin vibrate every time you receive an important message, a call or anything you want to make the material respond to. It can be very significant for staying ahead of all notifications and responding to them promptly. But then, it is just a patent yet and we are yet to see what it’s real-world applications can be.

[ttjad keyword=”nokia-smartphone”]

Salman

Salman Latif is a software engineer with a specific interest in social media, big data and real-world solutions using the two.Other than that, he is a bit of a gypsy. He also writes in his own blog. You can find him on Google+ and Twitter .

Leave a Reply